Plug and Play China launches call for global startup applications
Global innovation platform Plug and Play has announced a strategic partnership with the Hong Kong Science and Technology Parks Corporation (HKSTP) and launched a call for entries for the Elevator Pitching Competition 2023 (EPiC 2023).
Now in its seventh year, EPiC, the Elevator Pitch Competition, organized by HKSTP, is a unique, worldwide competition for startups in Fintech and Proptech to expand their footprints into Asia and beyond, by leveraging Hong Kong's biggest innovation ecosystem.
For EPiC 2023, Plug and Play will recruit startups from Asia, Europe, and North America by hosting regional competition before the winning startups head to Hong Kong to participate in the EPiC finals in April.
Saeed Amidi, CEO, Plug and Play: "The partnership with HKSTP for EPiC is an important step in leveraging the opportunities in Asia that will help us continue to build a world-leading innovation platform. We are working with trailblazers like HKSTP to build an innovative ecosystem across multiple industries by connecting the brightest minds with the world's leading companies, venture capital firms, universities, and government agencies."
Fintech and Proptech startups just need to submit a two-minute video presentation to gain a potentially life-changing opportunity. 50 shortlisted semi-finalists will have the chance for a direct investment of up to $5 million via the HKSTP Venture Fund. They will also gain access to market expansion support in Asia and afar, as well as $60K in cash prizes if they make the cut.
Albert Wong, CEO, HKSTP: "This year, EPiC, our flagship event, promises to be the biggest and best ever through this strategic partnership with the world-renowned Plug and Play, which solidifies HKSTP and Hong Kong as a unique global launchpad for innovators on their journey to growth and success."
For further details about EPiC 2023 application, contact: